Copper–Graphene Three‐Dimensional Structures Fabricated via One‐Step Localized Electrochemical Deposition

Microscale copper–graphene (Cu–Gr) structures exhibit great application potential in electronics, energy, and other fields. However, existing studies largely focus on coating fabrication, and systematic fabrication of Cu–Gr three‐dimensional (3D) structures remains unexplored, limiting their widespread applications. This work proposes a one‐step localized electrochemical codeposition method to fabricate superior Cu–Gr 3D structures and clarifies its codeposition mechanism. Surfactants and metal cations jointly regulate mass transfer and interfacial growth, realizing integrated structural formation. Graphene doping concentration exerts key regulatory effects on structure and performance. The results indicate that at Gr concentration of 300 mg/L, Gr achieves maximum reduction and dispersion in the copper matrix, which effectively promotes the nucleation process, refines the grain size, improves the surface quality, and comprehensively improves the properties of the structure. Compared with pure copper samples, the optimized Cu–Gr structure exhibits a microhardness of 3.9 GPa and an elastic modulus of 148 GPa, rising by 77% and 41%, respectively. Meanwhile, its resistivity reaches 6.78 × 10 −6 Ω cm and decreases by 26.9%, realizing synergistic optimization of mechanical and electrical properties. While retaining the inherent advantages of electrochemical three‐dimensional printing, this study further expands the application potential of Cu–Gr structures in the advanced manufacturing field.