Dual‐Anchored Interfacial Adhesion‐Enhanced Strain‐Insensitive Hydrogels Electronic Skin for Consciousness‐Driven Brain‐Computer Interface

Hydrogel‐based flexible circuits demand robust rigid‐soft interfacial adhesion, strain‐insensitive electrical performance, and reliable digital‐analog signal transmission capabilities to enable high‐performance electronic skin (e‐skin) applications. Here, we developed a 3D‐printable AgNSs/AA‐DMAPS hydrogel with tunable viscosity via a dual‐anchoring strategy, where silver nanosheets (AgNSs) create nano‐adhesion by forming dynamic crosslinked hydrogel networks. The resulting hydrogel exhibits strain insensitivity within 500% elongation, high electrical conductivity (>16 × 10 4 S/m), and superior multi‐interfacial adhesion properties. Notably, the dual‐anchoring design enables dynamic bonding with metal surfaces (∼450 kPa), allowing self‐welding to hardware without treatment. Flexible circuits printed with AgNSs/AA‐DMAPS hydrogel demonstrate near‐field communication (NFC) functionality and wireless charging, with flexible printed circuit (FPC) capable of transmitting high‐speed signals up to 8 MHz while maintaining effective image signal transmission under 50% strain. Our printed brain‐computer interface (BCI) e‐skin based on this hydrogel achieves EEG signal monitoring. In consciousness classification tasks using the BCI e‐skin, our proposed CNN‐LSTM model attained 90.8% accuracy across six categories. The classification system was deployed on a local server to drive robotic manipulation, enabling real‐time EEG‐controlled robotic hand movement through locally models. The AgNSs/AA‐DMAPS hydrogel‐based BCI e‐skin opens new possibilities for daily brain monitoring applications and continuous exploration of neuropsychiatric disease progression patterns.