Overcoming Thermodynamic and Kinetic Constraints of Recrystallization and Precipitation in Cu‐Ni‐Sn Alloy via Electropulsing Treatment

The performance optimization of ultrahigh‐strength Cu‐15Ni‐8Sn alloy relies on controlling recrystallization and aging precipitation, which are two thermally activated processes constrained by high activation barriers. Conventional heat treatment requires elevated temperatures and prolonged holding time, inevitably leading to grain coarsening and deleterious phase formation that hinder the synergistic property. Herein, this work reports an electropulsing treatment (EPT) strategy that simultaneously overcomes these thermodynamic and kinetic bottlenecks. The thermo‐electro coupling effect of EPT provides an athermal driving force, substantially reducing the thermodynamic barrier for recrystallization and the apparent activation energy for Sn precipitation. Specifically, recrystallization is achieved at ∼700°C (100°C reduction), whereas peak aging at 400°C requires merely 7 min, an 86‐fold efficiency enhancement. EPT concurrently suppresses coarse γ‐DO 3 formation, promotes nanoscale γ‐DO 22 /γ‐L1 2 ordered precipitates, refines grains, and weakens texture. Thermodynamic analysis reveals that EPT accelerates atomic diffusion and dislocation climb, enhancing recrystallization kinetics, while reducing the activation energy for Sn precipitation from 101.60 to 51.16 kJ mol −1 , enabling ultrarapid aging. This work provides insights into electropulsing‐enabled ultrafast microstructural regulation and offers a new pathway for developing high‐performance copper alloys.