研究论文
Optimal parameter design for chip-on-film technology using the Taguchi method
Ming-Hsien Caleb Li, Shih-Ming Hong
Feng Chia University
来源The International Journal of Advanced Manufacturing Technology
年份2004
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学术脉络
学科主题
工程Manufacturing Process and Optimization
Optimal Experimental Design Methods · Electronic Packaging and Soldering Technologies
参考文献 12
Quality Engineering using Design of Experiments
被引 582Madhav S. Phadke · 1989
Characteristic study of anisotropic-conductive film for chip-on-film packaging
被引 76Shyh-Ming Chang, Jwo‐Huei Jou, Adam Hsieh · Microelectronics Reliability · 2001
The evaluation of different base materials for high density flip chip on flex applications
被引 18Petteri Palm, Jarmo Määttänen, Alain Picault · Microelectronics International · 2001
此处列出前 3 条
引用本文 26
Study on resistance welding of glass fiber reinforced thermoplastic composites
被引 70Kavan Panneerselvam, S. Aravindan, A. Noorul Haq · Materials & Design (1980-2015) · 2012
Multi-characteristic optimization of wax patterns in the investment casting process using grey–fuzzy logic
被引 61Sarojrani Pattnaik, Dagarapu Benny Karunakar, Pradeep Kumar Jha · The International Journal of Advanced Manufacturing Technology · 2012
Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters
被引 47Hsin‐Te Liao, Jie‐Ren Shie, Yung‐Kuang Yang · The International Journal of Advanced Manufacturing Technology · 2007
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