研究论文
Design of surface grooves on a polishing pad based on slurry uniform flow
Jun Li, Junyang Huang, Chengxu Hua, Jianjie Wang, Yongwei Zhu, Dunwen Zuo
Nanjing University of Aeronautics and Astronautics
来源The International Journal of Advanced Manufacturing Technology
年份2019
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逐年被引趋势
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26
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26
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0.34
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同类平均 = 1
同类平均 = 1
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学术脉络
学科主题
工程Advanced Surface Polishing Techniques
Advanced machining processes and optimization · Erosion and Abrasive Machining
参考文献 22
Effect of Pad Groove Designs on the Frictional and Removal Rate Characteristics of ILD CMP
被引 47D. Rosales-Yeomans, Toshiro Doi, M. Kinoshita · Journal of The Electrochemical Society · 2004
Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior
被引 4Tsutomu Yamazaki, Toshiro Doi, Michio Uneda · Japanese Journal of Applied Physics · 2012
Effect of pad groove geometry on material removal characteristics in chemical mechanical polishing
被引 34Yongchang Guo, Hyunseop Lee, Youngkyun Lee · International Journal of Precision Engineering and Manufacturing · 2012
此处列出前 3 条
引用本文 26
Advanced polishing, grinding and finishing processes for various manufacturing applications: a review
被引 127Z.W. Zhong · Materials and Manufacturing Processes · 2020
Recent developments and applications of chemical mechanical polishing
被引 82Z.W. Zhong · The International Journal of Advanced Manufacturing Technology · 2020
Investigation of the trajectory uniformity in water dissolution ultraprecision continuous polishing of large-sized KDP crystal
被引 31Z. Cheng, Hang Gao, Ziyuan Liu · International Journal of Extreme Manufacturing · 2020
按被引量排序,此处列出前 3 条