研究论文
High-temperature electronic packaging for power modules: advances in sintering and transient liquid phase bonding technologies
Kai Cao, Jianhao Wang, Zehou Li, Jing Zhang, Yang Liu
Harbin University of Science and Technology Harbin University Heraeus (Germany)
来源Journal of Materials Science Materials in Electronics
年份2025
阅读操作
确认中在文库中上传 PDF 后可生成中文音频讲解。
摘要与影响
摘要 · 节选
暂未获取摘要。可打开原文或 PDF，后续可基于全文生成更完整的速读。
逐年被引趋势
320
25
326
关键指标
4
被引次数 · OpenAlex
7.46
领域内被引倍数
同类平均 = 1
同类平均 = 1
前 3%
引用位次
同领域 · 同年份 · 同类型
同领域 · 同年份 · 同类型
191
参考文献
Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。
AI 辅助阅读
依据：文献信息
论文问答
当前基于文献信息回答
可就本文提问；依据不足时会说明。
学术脉络
学科主题
经济 / 管理Financial Literacy, Pension, Retirement Analysis
Diverse Perspectives in Modern Studies · Urban, Neighborhood, and Segregation Studies
参考文献 191
Properties of Bulk Sintered Silver As a Function of Porosity
被引 71USDOE Office of Energy Efficiency and Renewable Energy (EERE), Andrew A. Wereszczak, Daniel J Vuono · 2012
Microscale Ag particle paste for sintered joints in high-power devices
被引 56Hiroshi Nishikawa, Xiangdong Liu, Xianfan Wang · Materials Letters · 2015
Improved mechanical properties in new, Pb-free solder alloys
被引 168M. McCormack, S. Jin · Journal of Electronic Materials · 1994
此处列出前 3 条
引用本文 4
Development of high-thermal conductive Ag@diamond composite sintering paste and its application in power modules
被引 1Chunhua Zhang, Canyu Liu, Changqing Liu · Applied Physics Letters · 2026
A high-performance bimodal Cu sintering paste assisted by resin binders with enhanced mechanical properties
被引 0Zhiyuan Zhang, Lin Liang, Junjie Li · Materials Science in Semiconductor Processing · 2026
Influence of surface micro-nanostructure morphology on direct sintering bonding between silver and silicon
被引 0Peilin Cao, Cong Wang, Zhuohong Li · Journal of Materials Science Materials in Electronics · 2026
按被引量排序，此处列出前 3 条