研究论文
Reliability Analysis of Solder Joints in Aerospace Electronics: Failure Mechanism, Modeling and Evaluation
Zhen Ma, Dongchao Diwu, Kai Wang, Jinyang Mu, Xiao An, Hu Wang, Ge Guo, HU Ying-xi 等 10 位
China Academy of Space Technology Xidian University
来源Journal of Failure Analysis and Prevention
年份2025
阅读操作
确认中在文库中上传 PDF 后可生成中文音频讲解。
摘要与影响
摘要 · 节选
暂未获取摘要。可打开原文或 PDF，后续可基于全文生成更完整的速读。
逐年被引趋势
210
226
关键指标
2
被引次数 · OpenAlex
0.57
领域内被引倍数
同类平均 = 1
同类平均 = 1
前 35%
引用位次
同领域 · 同年份 · 同类型
同领域 · 同年份 · 同类型
42
参考文献
Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。
AI 辅助阅读
依据：文献信息
论文问答
当前基于文献信息回答
可就本文提问；依据不足时会说明。
学术脉络
学科主题
工程Electronic Packaging and Soldering Technologies
Integrated Circuits and Semiconductor Failure Analysis · VLSI and Analog Circuit Testing
参考文献 42
Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling
被引 50Sa’d Hamasha, Awni Qasaimeh, Younis Jaradat · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015
The Small Bodies of the Solar System
被引 1I. P. Williams, A. Fitzsimmons · Lecture notes in physics · 2001
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
被引 22John H. Lau, Walter Dauksher · Journal of Electronic Packaging · 2005
此处列出前 3 条
引用本文 2
Failure mechanisms of PBGA packages under coupled humidity-thermal-electrical fields: Electrochemical migration behavior and multi-physics simulation
被引 0Jiayue Wen, Shang Wang, Yunxuan Zhang · Microelectronics Reliability · 2026
Thermal interface materials for high-power LED packaging: advances, reliability and design guidelines
被引 0Armin Rahmati Darvazi, Alireza Eslami Majd, N.N. Ekere · Thermal Science and Engineering Progress · 2026
按被引量排序，此处列出前 3 条