研究论文
A study on the correlation between pad property and material removal rate in CMP
Changsuk Lee, Hojun Lee, Moonki Jeong, Haedo Jeong
Pusan National University
来源International Journal of Precision Engineering and Manufacturing
年份2011
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学术脉络
学科主题
工程Advanced Surface Polishing Techniques
Advanced machining processes and optimization · Surface Roughness and Optical Measurements
参考文献 10
The Elastic Contact Analysis of 3D Rough Surface of Nongaussian Height Distribution
被引 2Tae‐Wan Kim, Young-Pil Koo, Yongjoo Cho · Journal of the Korean Society for Precision Engineering · 2001
Structural Characteristics of the Oxide on the (111) of Copper
被引 22J. V. Cathcart, G. F. Petersen · Journal of The Electrochemical Society · 1968
Investigation of Pad Surface Topography Distribution for Material Removal Uniformity in CMP Process
被引 34Kihyun Caleb Park, Haedo Jeong · Journal of The Electrochemical Society · 2008
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引用本文 32
A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization
被引 176Jihoon Seo · Journal of materials research/Pratt's guide to venture capital sources · 2021
Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing
被引 165Shang Gao, Honggang Li, Han Huang · Applied Surface Science · 2022
Modeling the microscale contact status in chemical mechanical polishing process
被引 59Lin Wang, Ping Zhou, Ying Yan · International Journal of Mechanical Sciences · 2022
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