研究论文
Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints
Van Luong Nguyen, Sang Hoon Kim, Jae Won Jeong, Tae-Soo Lim, Dong-Yeol Yang, Ki Bong Kim, Young Ja Kim, Jun Hong Lee 等 10 位
Korea Institute of Materials Science
来源Electronic Materials Letters
年份2017
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学术脉络
学科主题
工程Electronic Packaging and Soldering Technologies
Intermetallics and Advanced Alloy Properties · Metal and Thin Film Mechanics
参考文献 29
Mechanical properties of intermetallic compounds at the Sn–3.0Ag–0.5Cu/Cu joint interface using nanoindentation
被引 55Gesheng Xiao, Xuexia Yang, Guozheng Yuan · Materials & Design · 2015
Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation
被引 60Feng Gao, Tatsuya Takemoto · Materials Letters · 2006
Thermodynamic re-optimisation of the Bi–In–Sn system based on new experimental data
被引 71V.T. Witusiewicz, U. Hecht, B. Böttger · Journal of Alloys and Compounds · 2006
此处列出前 3 条
引用本文 25
Low melting point solders based on Sn, Bi, and In elements
被引 246Yingxia Liu, K. N. Tu · Materials Today Advances · 2020
Shape-stable Bi-Sn-In alloy/Ag/copper foam composite phase change material for thermal storage and management
被引 45Kunlun Chen, Jing Ding, Weilong Wang · Chemical Engineering Journal · 2022
Micro-encapsulation of a low-melting-point alloy phase change material and its application in electronic thermal management
被引 41Shuo Wang, Xiangyu Zhao, Zhiyuan Wang · Journal of Cleaner Production · 2023
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