Study on tri-imidazole derivatives modified with triazine-trione structure as latent curing agents for epoxy resin
Xiaodong Wan, Jianben Liu, Xi Chen, Jun Wang
China Electric Power Research Institute Wuhan University of Technology
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In this paper, four novel kinds of triazine-trione based tri-imidazole derivatives (IM-TT, 2MI-TT, 2EI-TT and EMI-TT) were synthesized through the addition reaction between triglycidyl isocyanurate (TGIC) and imidazole (IM), 2-methylimidazole (2MI), 2-ethylimidazole (2EI) and 2-ethyl-4-methylimidazole (EMI), respectively. The triazine-trione based tri-imidazole derivatives were blended with epoxy resin and the reactivity, thermal latency and thermal property were investigated. The results on curing behaviors indicated that the curing exothermic peaks of the blends with triazine-trione based tri-imidazole derivatives shifted to higher temperatures compared with those with commercial imidazoles. The curing exothermic peak temperatures (Tps) of the synthesized tri-imidazole derivatives were increased by 23–32 ℃ compared with the unmodified imidazoles. In addition, Rheological behavior results indicated that the EP blends with tri-imidazole derivatives also exhibited excellent storage stability which was as long as 38 days under room temperature. Last but not the least, the EP blends with triazine-trione based tri-imidazole derivatives also exhibited high glass transition temperatures due to introducing of triazine-trione structures with high crosslinking density. The glass transition temperatures (Tgs) of the prepared thermosets ranged from 128 to 152 ℃. The triazine-trione based tri-imidazole derivatives provide a way to prepare latency epoxy resin with high high glass transition temperature and long storage stability. Article Highlights Four novel kinds of triazine-trione based tri-imidazole derivatives were synthesized. The EP cured with the tri-imidazole derivatives displayed great thermostability. The EP cured with the tri-imidazole derivatives exhibited long storage stability.
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工程Epoxy Resin Curing Processes
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