研究论文
Achieving high strength and electrical conductivity in hierarchical structured pure copper
M. R. Sabour, E. Taherkhani, Vahid Tavakkoli, A. Jalali Aghchai, G. Faraji
University of Tehran K.N.Toosi University of Technology Ruhr University Bochum
来源Archives of Civil and Mechanical Engineering
年份2026
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材料 / 化学Microstructure and mechanical properties
Aluminum Alloys Composites Properties · Cellular and Composite Structures
参考文献 93
Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process
被引 59Arash Fattah‐alhosseini, Omid Imantalab, Yousef Mazaheri · Materials Science and Engineering A · 2015
Enhancing tensile strength of Cu by introducing gradient microstructures via a simple torsion deformation
被引 64Ning Guo, Bo Song, Hongbing Yu · Materials & Design · 2015
Microstructural response of pure copper to cryogenic rolling
被引 160Tatyana Konkova, S. Mironov, А. В. Корзников · Acta Materialia · 2010
此处列出前 3 条
引用本文 6
From coated fibers to fully dense alloys: Introducing entangled coated fiber plasma sintering for Cu–Fe systems
被引 3H. Rahimi, M. R. Sabour, E. Taherkhani · Journal of Materials Research and Technology · 2026
Physics-Aware Strain Correction in Sheet Metal Forming: Validation through Microstructural Evolution
被引 0Xiaohua Zhang, Zhenxing Wang, Jun Wang · Journal of Materials Engineering and Performance · 2026
A three-dimensional intertwined fiber architecture enables exceptional strength–conductivity synergy in immiscible Cu–Fe systems
被引 0E. Taherkhani, M.R. Sabour, H. Rahimi · Materials Today Advances · 2026
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