研究论文

Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration

Yuan Chen, Jia Juen Ong, Dinh-Phuc Tran, Wei-Lan Chiu, Hsiang‐Hung Chang, Wei-You Hsu, Chih Chen

National Yang Ming Chiao Tung University　Industrial Technology Research Institute

来源Applied Surface Science

年份2025

DOI10.1016/j.apsusc.2025.162534

原文https://doi.org/10.1016/j.apsusc.2025.162534

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摘要与影响

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逐年被引趋势

740

726

关键指标

被引次数 · OpenAlex

1.59

领域内被引倍数
同类平均 = 1

前 19%

引用位次
同领域 · 同年份 · 同类型

参考文献

Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。

AI 辅助阅读

依据：文献信息

论文问答

当前基于文献信息回答

可就本文提问；依据不足时会说明。

学术脉络

学科主题

工程

3D IC and TSV technologies

Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability

参考文献 36

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Chien-Min Liu, Hanwen Lin, Yi-Sa Huang · Scientific Reports · 2015

被引 257

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

Yann Beilliard, Thomas Signamarcheix, Stephane Moreau · International 3D Systems Integration Conference (3DIC) · 2014

被引 41

Plasma particulate contamination control. I. Transport and process effects

Gary S. Selwyn · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1991

被引 68

此处列出前 3 条

引用本文 7

Research Progress on the Surface/Interface Reaction Mechanism of Metal/Dielectric Heterogeneous Materials in Hybrid Bonding

Xuze Li, Yu Zhang, Fei Ding · IEEE Transactions on Components Packaging and Manufacturing Technology · 2026

被引 2

Process-induced thermal conductivity degradation in Cu micro pads for 3D-IC hybrid bonding revealed by spatially resolved frequency-domain thermoreflectance

Yang Lu, Rui Zhou, Han Jiang · Applied Thermal Engineering · 2026

被引 1

Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations

Dongjin Kim, Seonghui Han, Junha Baik · Microelectronics Reliability · 2026

被引 1

按被引量排序，此处列出前 3 条

研究论文

Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration

Yuan Chen, Jia Juen Ong, Dinh-Phuc Tran, Wei-Lan Chiu, Hsiang‐Hung Chang, Wei-You Hsu, Chih Chen

National Yang Ming Chiao Tung University　Industrial Technology Research Institute

来源Applied Surface Science

年份2025

DOI10.1016/j.apsusc.2025.162534

原文https://doi.org/10.1016/j.apsusc.2025.162534

阅读操作

确认中

在文库中上传 PDF 后可生成中文音频讲解。

摘要与影响

摘要 · 节选

暂未获取摘要。可打开原文或 PDF，后续可基于全文生成更完整的速读。

逐年被引趋势

740

726

关键指标

被引次数 · OpenAlex

1.59

领域内被引倍数
同类平均 = 1

前 19%

引用位次
同领域 · 同年份 · 同类型

参考文献

Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。

AI 辅助阅读

依据：文献信息

论文问答

当前基于文献信息回答

可就本文提问；依据不足时会说明。

学术脉络

学科主题

工程

3D IC and TSV technologies

Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability

参考文献 36

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Chien-Min Liu, Hanwen Lin, Yi-Sa Huang · Scientific Reports · 2015

被引 257

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

Yann Beilliard, Thomas Signamarcheix, Stephane Moreau · International 3D Systems Integration Conference (3DIC) · 2014

被引 41

Plasma particulate contamination control. I. Transport and process effects

Gary S. Selwyn · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1991

被引 68

此处列出前 3 条

引用本文 7

Research Progress on the Surface/Interface Reaction Mechanism of Metal/Dielectric Heterogeneous Materials in Hybrid Bonding

Xuze Li, Yu Zhang, Fei Ding · IEEE Transactions on Components Packaging and Manufacturing Technology · 2026

被引 2

Process-induced thermal conductivity degradation in Cu micro pads for 3D-IC hybrid bonding revealed by spatially resolved frequency-domain thermoreflectance

Yang Lu, Rui Zhou, Han Jiang · Applied Thermal Engineering · 2026

被引 1

Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations

Dongjin Kim, Seonghui Han, Junha Baik · Microelectronics Reliability · 2026

被引 1

按被引量排序，此处列出前 3 条