研究论文
Boron nitride filled epoxy with improved thermal conductivity and dielectric breakdown strength
Martin Donnay, Spiros Tzavalas, E. Logakis
ABB (Switzerland)
来源Composites Science and Technology
年份2015
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材料 / 化学Thermal properties of materials
High voltage insulation and dielectric phenomena · Epoxy Resin Curing Processes
参考文献 39
High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure
被引 60Hong He, Renli Fu, Yanchun Han · Journal of Electronic Packaging · 2007
Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
被引 676Ching Ping Wong, R.S. Bollampally · Journal of Applied Polymer Science · 1999
Thermal conductivity and mechanical properties of BN-filled epoxy composite: effects of filler content, mixing conditions, and BN agglomerate size
被引 114Karnthidaporn Wattanakul, Hathaikarn Manuspiya, Nantaya Yanumet · Journal of Composite Materials · 2011
此处列出前 3 条
引用本文 228
Review of thermal conductivity in composites: Mechanisms, parameters and theory
被引 1,368N. Burger, Abdelghani Laachachi, M. Ferriol · Progress in Polymer Science · 2016
Ice‐Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement
被引 620Xiaoliang Zeng, Yimin Yao, Zhengyu Gong · Small · 2015
Thermal conductivity of 2D nano-structured boron nitride (BN) and its composites with polymers
被引 613Valentina Guerra, Chaoying Wan, Tony McNally · Progress in Materials Science · 2018
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