研究论文
Investigation of Z-type manifold microchannel cooling for ultra-high heat flux dissipation in power electronic devices
Shudong Yang, Junye Li, Biqi Cao, Zan Wu, Kuang Sheng
Zhejiang University
来源International Journal of Heat and Mass Transfer
年份2023
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133
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学术脉络
学科主题
工程Heat Transfer and Optimization
Heat Transfer and Boiling Studies · Heat transfer and supercritical fluids
参考文献 37
Microscale study of mechanisms of heat transfer during flow boiling in a microchannel
被引 104Sajjad Bigham, Saeed S. Moghaddam · International Journal of Heat and Mass Transfer · 2015
Transient flow boiling heat-transfer measurements in microdomains
被引 37Sameer R. Rao, Farzad Houshmand, Yoav P. Peles · International Journal of Heat and Mass Transfer · 2014
Describing the uncertainties in experimental results
被引 9,849Robert J. Moffat · Experimental Thermal and Fluid Science · 1988
此处列出前 3 条
引用本文 133
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
被引 248Ziyong Li, Hailiang Luo, Yuguang Jiang · Applied Thermal Engineering · 2024
Advancements in thermal management solutions for electric vehicle high-power electronics: Innovations, cooling methods, and future perspectives
被引 90Muhammad Asim, Taha Baig, Farooq Riaz Siddiqui · Journal of Energy Storage · 2025
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
被引 80Zhihu Wu, Wei Xiao, Hongyan He · Nature Electronics · 2025
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