研究论文
Mechanical skin pain and comfort evaluation model applied to skin-integrated electronics
Yunfan Zhu, Dongcan Ji, Yang Wang, Yuhang Li, Min Li, Jiayun Chen, Y. Ma
Ningbo University University of Nottingham Ningbo China Beihang University Research Institute for Electromagnetic Materials
来源International Journal of Solids and Structures
年份2025
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学科主题
工程Advanced Sensor and Energy Harvesting Materials
Tactile and Sensory Interactions · Ergonomics and Musculoskeletal Disorders
参考文献 87
Temperature effects on surface pressure-induced changes in rat skin perfusion: implications in pressure ulcer development.
被引 63S Patel, C. F. Knapp, James C. Donofrio · PubMed · 1999
A computational model of acute pain
被引 18Karen Prince, J. A. Campbell, Philip Picton · 2004
Transcutaneous Electrical Nerve Stimulation
被引 51David Ottoson, Thomas Lundeberg · 1988
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引用本文 4
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被引 1Zixuan Jin, Tianle Zhang, Demin Tu · Advanced Materials Technologies · 2025
A practical method to simultaneously predict interfacial strength and toughness based on the peeling model of a heterogeneous elastic film
被引 0Zimo Zhao, Yonggui Cheng, Yin Yao · International Journal of Solids and Structures · 2026
Mechanics analysis of support loss mechanisms in flexible MEMS resonators
被引 0Siyu Chen, Shuolong Yang, Chengzhong Ma · Journal of Sound and Vibration · 2026
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