Nano-copper sintering technology for packaging of silicon carbide power devices: Recent advances in anti-oxidation strategies, low-temperature interconnection mechanisms, and reliability

Aihua Sun, 刘苗青, Fupeng Huo, Peng Zhang, Lei Duan, Jianjun Guo, Chuantong Chen, Katsuaki Suganuma 等 9 位

University of Science and Technology of China　Wuhan Engineering Science & Technology Institute　Ningbo Institute of Industrial Technology　Nanjing University of Aeronautics and Astronautics