研究论文
Optimizing machinability and minimizing dislocation slip in hexagonal silicon carbide: The role of off-axis angle and processing surface type
Jianwei Ji, Cheng Fan, Binbin Meng
Chongqing University of Technology Soochow University
来源Journal of Manufacturing Processes
年份2024
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学科主题
工程Advanced Surface Polishing Techniques
Advanced Machining and Optimization Techniques · Diamond and Carbon-based Materials Research
参考文献 49
A study of chip formation in ductile-regime machining of 6H silicon carbide by molecular dynamics
被引 12Gaobo Xiao, Suet To, Guoqing Zhang · International Journal of Nanomanufacturing · 2015
Molecular dynamics simulations of nanoscratching of 3C SiC
被引 67Alice Noreyan, Jacques G. Amar · Wear · 2008
Transmission electron microscopy analysis of mechanical polishing-related damage in silicon carbide wafers
被引 42J.R. Grim, Mourad Benamara, Marek Skowroński · Semiconductor Science and Technology · 2006
此处列出前 3 条
施引文献 4
AI-powered semiconductor wafer fabrication: A manufacturing paradigm shift
被引 8Guanwei He, Qingqing Huang, Qingqing Huang · International Journal of Machine Tools and Manufacture · 2025
Brittle fracture control of 4H-SiC via laser-textured surfaces: Combined experimental and atomistic study
被引 2Yuqi Zhou, Kezhong Xu, Yuhan Gao · Diamond and Related Materials · 2025
Atomic-level material removal mechanism of InP in ultra-precision diamond cutting
被引 0Hanheng Du, Tingwei CAO, Peizheng LIU · International Journal of Mechanical Sciences · 2026
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