研究论文
A process model of wafer thinning by diamond grinding
Chao‐Chang A. Chen, Li-Sheng Hsu
National Taiwan University of Science and Technology
来源Journal of Materials Processing Technology
年份2007
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工程Advanced Surface Polishing Techniques
Advancements in Photolithography Techniques · Industrial Vision Systems and Defect Detection
参考文献 11
Advantages of wet chemical spin-processing for wafer thinning and packaging applications
被引 11M.A.M. Hendrix, S. Drews, Trace Hurd · 2002
State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer
被引 22Libo ZHOU, Hiroshi Eda, Jun Shimizu · Journal of Materials Processing Technology · 2002
Effect of wafer thinning methods towards fracture strength and topography of silicon die
被引 49Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar · Microelectronics Reliability · 2005
此处列出前 3 条
引用本文 41
The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
被引 55Hongfei Tao, Yuanhang Liu, Dewen Zhao · International Journal of Mechanical Sciences · 2022
Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
被引 50Hongfei Tao, Yuanhang Liu, Dewen Zhao · Tribology International · 2023
Prediction model for surface shape of YAG wafers in wafer rotational grinding
被引 40Jinxing Huang, Renke Kang, Zhigang Dong · International Journal of Mechanical Sciences · 2025
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