研究论文

Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature

Yanhong Tian, Chunqing Wang, I. Lum, M. Mayer, Jae Pil Jung, Y. Zhou

Harbin Institute of Technology　University of Waterloo　University of Seoul

来源Journal of Materials Processing Technology

年份2008

DOI10.1016/j.jmatprotec.2007.12.134

原文https://doi.org/10.1016/j.jmatprotec.2007.12.134

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Electronic Packaging and Soldering Technologies

3D IC and TSV technologies · Advanced Welding Techniques Analysis

参考文献 18

Wire bonding in microelectronics : materials, processes, reliability, and yield

George G. Harman · McGraw-Hill eBooks · 1997

被引 370

Deformation and bonding processes in aluminum ultrasonic wire wedge bonding

James E. Krzanowski, Nikhil M. Murdeshwar · Journal of Electronic Materials · 1990

被引 53

Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Characterization · 2003

被引 88

此处列出前 3 条

引用本文 55

Overview of wire bonding using copper wire or insulated wire

Z.W. Zhong · Microelectronics Reliability · 2010

被引 109

Unconventional applications of wire bonding create opportunities for microsystem integration

A C Fischer, Jan Gerrit Korvink, Niclas Roxhed · Journal of Micromechanics and Microengineering · 2013

被引 107

Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding

Junhui Li, Liu Linggang, Luhua Deng · IEEE Electron Device Letters · 2011

被引 84

按被引量排序，此处列出前 3 条