研究论文

Influence of Ti content on microstructure and thermal conductivity of diamond/Cu composites fabricated by spark plasma sintering

Hongsheng Chen, Kang Chen, Yichen Zhang, Jin Li, Xuesong Leng

Harbin Institute of Technology

来源Materials Letters

年份2025

DOI10.1016/j.matlet.2025.139752

原文https://doi.org/10.1016/j.matlet.2025.139752

阅读操作

确认中

在文库中上传 PDF 后可生成中文音频讲解。

摘要与影响

摘要 · 节选

暂未获取摘要。可打开原文或 PDF，后续可基于全文生成更完整的速读。

逐年被引趋势

420

426

关键指标

被引次数 · OpenAlex

1.28

领域内被引倍数
同类平均 = 1

前 22%

引用位次
同领域 · 同年份 · 同类型

参考文献

Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。

AI 辅助阅读

依据：文献信息

论文问答

当前基于文献信息回答

可就本文提问；依据不足时会说明。

学术脉络

学科主题

工程

Aluminum Alloys Composites Properties

Advanced ceramic materials synthesis · Advanced materials and composites

参考文献 6

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Jianwei Li, Xitao Wang, Yi Qiao · Scripta Materialia · 2015

被引 176

Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond

Guo Chang, Fangyuan Sun, Jialiang Duan · Acta Materialia · 2018

被引 183

Semicoherent oxide heterointerfaces: Structure, properties, and implications

Blas P. Uberuaga, Pratik P. Dholabhai, Ghanshyam Pilania · APL Materials · 2019

被引 39

此处列出前 3 条

引用本文 4

Effects of transition metal carbide (TiC, VC, NbC) binder on mechanical properties and thermal conductivity of cubic boron nitride hard composites

Takeru Sakamoto, Takuya Sasaki, Ken Niwa · Diamond and Related Materials · 2026

被引 2

Property modulation and microstructural analysis of copper/diamond composites via Ti3AlC2 addition

Yueying Yu, Yuanwei Jia, Hongming Wei · Diamond and Related Materials · 2026

被引 0

Reduction of current-induced temperature rise in copper wires via copper-carbon interface modification and graphene chain-like network construction

Zhaohan Jiang, Yanlong Xiang, Guohui Chao · Composites Part B Engineering · 2026

被引 0

按被引量排序，此处列出前 3 条

研究论文

Influence of Ti content on microstructure and thermal conductivity of diamond/Cu composites fabricated by spark plasma sintering

Hongsheng Chen, Kang Chen, Yichen Zhang, Jin Li, Xuesong Leng

Harbin Institute of Technology

来源Materials Letters

年份2025

DOI10.1016/j.matlet.2025.139752

原文https://doi.org/10.1016/j.matlet.2025.139752

阅读操作

确认中

在文库中上传 PDF 后可生成中文音频讲解。

摘要与影响

摘要 · 节选

暂未获取摘要。可打开原文或 PDF，后续可基于全文生成更完整的速读。

逐年被引趋势

420

426

关键指标

被引次数 · OpenAlex

1.28

领域内被引倍数
同类平均 = 1

前 22%

引用位次
同领域 · 同年份 · 同类型

参考文献

Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。

AI 辅助阅读

依据：文献信息

论文问答

当前基于文献信息回答

可就本文提问；依据不足时会说明。

学术脉络

学科主题

工程

Aluminum Alloys Composites Properties

Advanced ceramic materials synthesis · Advanced materials and composites

参考文献 6

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Jianwei Li, Xitao Wang, Yi Qiao · Scripta Materialia · 2015

被引 176

Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond

Guo Chang, Fangyuan Sun, Jialiang Duan · Acta Materialia · 2018

被引 183

Semicoherent oxide heterointerfaces: Structure, properties, and implications

Blas P. Uberuaga, Pratik P. Dholabhai, Ghanshyam Pilania · APL Materials · 2019

被引 39

此处列出前 3 条

引用本文 4

Effects of transition metal carbide (TiC, VC, NbC) binder on mechanical properties and thermal conductivity of cubic boron nitride hard composites

Takeru Sakamoto, Takuya Sasaki, Ken Niwa · Diamond and Related Materials · 2026

被引 2

Property modulation and microstructural analysis of copper/diamond composites via Ti3AlC2 addition

Yueying Yu, Yuanwei Jia, Hongming Wei · Diamond and Related Materials · 2026

被引 0

Reduction of current-induced temperature rise in copper wires via copper-carbon interface modification and graphene chain-like network construction

Zhaohan Jiang, Yanlong Xiang, Guohui Chao · Composites Part B Engineering · 2026

被引 0

按被引量排序，此处列出前 3 条