研究论文
Low-k a-SiCO:H films as diffusion barriers for advanced interconnects
Els Van Besien, Arjun Singh, Y. Barbarin, Patrick Verdonck, Harold Dekkers, Kris Vanstreels, Jean‐François de Marneffe, Mikhaı̈l R. Baklanov 等 9 位
IMEC
来源Microelectronic Engineering
年份2013
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学术脉络
学科主题
材料 / 化学Copper Interconnects and Reliability
Semiconductor materials and devices · Metal and Thin Film Mechanics
参考文献 11
Diffusion barrier integrity evaluation by ellipsometric porosimetry
被引 42Denis Shamiryan, Mikhaı̈l R. Baklanov, Karen Maex · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2003
Physical and Barrier Properties of Amorphous Silicon-Oxycarbide Deposited by PECVD from Octamethylcyclotetrasiloxane
被引 27Chiu-Chih Chiang, Mao‐Chieh Chen, Lain‐Jong Li · Journal of The Electrochemical Society · 2004
Determination of pore size distribution in thin films by ellipsometric porosimetry
被引 510Mikhaı̈l R. Baklanov, K. P. Mogilnikov, V. G. Polovinkin · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000
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引用本文 11
Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects
被引 148Sean W. King · ECS Journal of Solid State Science and Technology · 2014
CMOS back-end compatible memristors for in situ digital and neuromorphic computing applications
被引 39Zhenyu He, Tianyu Wang, Jialin Meng · Materials Horizons · 2021
Unveiling the origin of the anti-fogging performance of plasma-coated glass: Role of the structure and the chemistry of siloxane precursors
被引 30Iván Rodríguez Durán, Jacopo Profili, Luc Stafford · Progress in Organic Coatings · 2020
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