研究论文
Reliability challenges in CMOS technology: A manufacturing process perspective
Qiao Teng, Yongkang Hu, Ran Cheng, Yongyu Wu, Guodong Zhou, Dawei Gao
Zhejiang University University of Science and Technology of China Zhejiang University of Science and Technology
来源Microelectronic Engineering
年份2023
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逐年被引趋势
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25
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2.07
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同类平均 = 1
同类平均 = 1
前 13%
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同领域 · 同年份 · 同类型
90
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学术脉络
学科主题
工程Integrated Circuits and Semiconductor Failure Analysis
Semiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design
参考文献 90
Reduction of boron thermal diffusion in silicon by high energy fluorine implantation
被引 33H.A.W. El Mubarek, P. Ashburn · Applied Physics Letters · 2003
Wet or dry ultrathin oxides: impact on gate oxide and device reliability
被引 9S. Bruyère, F. Guyader, W. De Coster · Microelectronics Reliability · 2000
Damage to thin gate oxide during lightly doped drain spacer oxide etching
被引 9Calvin T. Gabriel, Milind Weling · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1994
此处列出前 3 条
引用本文 25
The Understanding and Compact Modeling of Reliability in Modern Metal–Oxide–Semiconductor Field-Effect Transistors: From Single-Mode to Mixed-Mode Mechanisms
被引 17Zixuan Sun, Sihao Chen, Lining Zhang · Micromachines · 2024
Intelligent reliability assurance methodologies for engineering systems: advances and challenges
被引 10Zhiliang Liu, Qin Zhang, Yu Liu · Journal of Reliability Science and Engineering · 2025
Dual impact of Nd3+ doping on CeO2 abrasives: enhancing chemical and mechanical effects in chemical–mechanical polishing
被引 8Yesheng Zhang, Lei Hong, Jianhua Zhang · Surface Science and Technology · 2025
按被引量排序，此处列出前 3 条