研究论文
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
J. Eckermann, Shahid Mehmood, H. Davies, Nicholas Lavery, S. G. R. Brown, Johann Sienz, A. A. Jones, Peter Sommerfeld
Swansea University
来源Microelectronics Reliability
年份2014
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学科主题
工程Electronic Packaging and Soldering Technologies
High Temperature Alloys and Creep · Metallurgy and Material Forming
参考文献 23
Characterization of Lead-free Solders for Electronic Packaging
被引 8Hongtao Ma · PhDT · 2007
Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In
被引 58A.A. El-Daly, Farid El‐Tantawy, A.E. Hammad · Journal of Alloys and Compounds · 2011
Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects
被引 95Yoshiharu Kariya, Takuya Hosoi, Shin‐Ichi Terashima · Journal of Electronic Materials · 2004
此处列出前 3 条
引用本文 22
Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly
被引 143A.A. El-Daly, A. M. El-Taher, Shaimaa Gouda · Journal of Alloys and Compounds · 2014
Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
被引 125Joshua Adeniyi Depiver, Sabuj Mallik, Emeka H. Amalu · Engineering Failure Analysis · 2021
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
被引 63Joshua Adeniyi Depiver, Sabuj Mallik, Emeka H. Amalu · Journal of Electronic Materials · 2020
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