研究论文
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Yang Liu, Stanley Y.Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo
Harbin University of Science and Technology Beijing University of Technology Chinese Academy of Sciences Institute of Semiconductors
来源Microelectronics Reliability
年份2014
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逐年被引趋势
950
16
17
918
19
20
21
22
23
24
25
关键指标
46
被引次数 · OpenAlex
2.34
领域内被引倍数
同类平均 = 1
同类平均 = 1
前 11%
引用位次
同领域 · 同年份 · 同类型
同领域 · 同年份 · 同类型
13
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学术脉络
学科主题
工程Electronic Packaging and Soldering Technologies
GaN-based semiconductor devices and materials · 3D IC and TSV technologies
参考文献 13
High-Mobility Transparent SnO2 and ZnO–SnO2 Thin-Film Transistors with SiO2/Al2O3 Gate Insulators
被引 18Woo‐Seok Cheong, Sung‐Min Yoon, Chi‐Sun Hwang · Japanese Journal of Applied Physics · 2009
Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps
被引 21Cheng-Chen Lin, Liann‐Be Chang, Ming‐Jer Jeng · Microelectronics Reliability · 2010
Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs
被引 140Junhui Li, Bangke Ma, Ruishan Wang · Microelectronics Reliability · 2011
此处列出前 3 条
引用本文 46
Heat and fluid flow in high-power LED packaging and applications
被引 461Xiaobing Luo, Run Hu, Sheng Liu · Progress in Energy and Combustion Science · 2016
Application of micro/nano technology for thermal management of high power LED packaging – A review
被引 123Mohammad Hamidnia, Yi Luo, X.D. Wang · Applied Thermal Engineering · 2018
Die attachment, wire bonding, and encapsulation process in LED packaging: A review
被引 94Md Abdul Alim, M.Z. Abdullah, Mohd Sharizal Abdul Aziz · Sensors and Actuators A Physical · 2021
按被引量排序，此处列出前 3 条