研究论文
Impact reliability analysis of a rigid-flex PCB system under acceleration loads
Bowen Zhang, Guangbao Shan, Fei Su
Beihang University Xidian University
来源Microelectronics Reliability
年份2021
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学术脉络
学科主题
工程Electronic Packaging and Soldering Technologies
Advanced MEMS and NEMS Technologies · Mechanical Behavior of Composites
参考文献 35
Impact reliability of solder joints
被引 89M. Date, Takuo Shoji, M. Fujiyoshi · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2004
Conformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology
被引 2Amin Enayati, Michael Libois, W. De Raedt · 2011
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
被引 181Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005
此处列出前 3 条
引用本文 10
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging
被引 7Yangtao Long, Mingtao Lv, Hu He · IEEE Transactions on Device and Materials Reliability · 2024
Experimental and damage-coupled crystal plasticity constitutive study for solder ball under shear tests
被引 6Lu Liu, Huangyue Yu, Yang Li · Engineering Fracture Mechanics · 2025
Mathematical modeling of flexible printed circuit configuration: a study in deformation and optimization
被引 6Longhui Meng, Liang Ding, Aqib Mashood Khan · Scientific Reports · 2024
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