研究论文
Machine learning for board-level drop response of BGA packaging structure
Minghui Mao, Wenwu Wang, Changheng Lu, Fengrui Jia, Xu Long
Liaoning Shihua University Northwestern Polytechnical University Tsinghua University
来源Microelectronics Reliability
年份2022
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35
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1.95
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同类平均 = 1
同类平均 = 1
前 14%
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学术脉络
学科主题
工程Electronic Packaging and Soldering Technologies
3D IC and TSV technologies · Electrostatic Discharge in Electronics
参考文献 45
Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test
被引 4Yuan Guo, Xia Chen, Xue Feng Shu · Advanced materials research · 2014
Board Level Drop Impact—Fundamental and Parametric Analysis
被引 46E.H. Wong, Y-W Mai, S.K.W. Seah · Journal of Electronic Packaging · 2005
Surface finish effect on reliability of SAC 305 soldered chip resistors
被引 48Maurice N. Collins, Jeff Punch, Richard Coyle · Soldering and Surface Mount Technology · 2012
此处列出前 3 条
引用本文 35
A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures
被引 15Yanpeng Gong, Y. He, Han Hu · Engineering Structures · 2024
Thermomechanical constitutive behaviour of 3D printed biomimetic polymer material under high strain rates
被引 15Xu Long, Yuntao Hu, Tianxiong Su · Polymer Testing · 2024
Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics
被引 15Guoshun Wan, Qi Dong, Xiaochen Sun · Microelectronics Reliability · 2024
按被引量排序，此处列出前 3 条