研究论文
Optimized selection of materials for IGBT module packaging
Omid Alavi, W. De Ceuninck, Michaël Daenen
IMEC Hasselt University
来源Microelectronics Reliability
年份2022
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工程Silicon Carbide Semiconductor Technologies
Aluminum Alloys Composites Properties · Induction Heating and Inverter Technology
参考文献 24
Power Electronic Modules: Design and Manufacture
被引 107William W. Sheng, Ronald P. Colino · Thammasat University Digital Collections · 2004
Microheat exchanger for cooling high power laser diodes
被引 30Madhav Datta, Hae-Won Choi · Applied Thermal Engineering · 2015
A state-of the-art survey of TOPSIS applications
被引 2,682Majid Behzadian, Sina Khanmohammadi Otaghsara, Morteza Yazdani · Expert Systems with Applications · 2012
此处列出前 3 条
引用本文 12
Warping model of high-power IGBT modules subjected to reflow soldering process
被引 30Shang Gao, Rongliang Wang, Haoxiang Wang · International Journal of Mechanical Sciences · 2023
Theoretical screening and experimental fabrication of metallized layer for enhanced Cu wetting and adhesion on Si3N4 substrate
被引 4Xiangzhao Zhang, Zhou Yansheng, Yinuo Zhang · Ceramics International · 2025
Effect of Sn element on the interfacial reinforced AlN/Cu joint brazed by Ag–Cu–Ti–(Snx) filler
被引 4Yuqi Tian, Jun Gao, Yan Li · Journal of Materials Science Materials in Electronics · 2024
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