研究论文
Investigation on fatigue mechanism of solder layers in IGBT modules under high temperature gradients
Shihan Zhao, Xin Yang, Xinlong Wu, Yue Zhang, Guoyou Liu
Hunan University
来源Microelectronics Reliability
年份2023
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逐年被引趋势
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32
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2.58
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工程Silicon Carbide Semiconductor Technologies
Silicon and Solar Cell Technologies · Electrostatic Discharge in Electronics
参考文献 46
Reliability Assessment of Packaging Solder Joints Under Different Thermal Cycle Loading Rates
被引 48Kai–Chiang Wu, Si-Yun Lin, Tuan-Yu Hung · IEEE Transactions on Device and Materials Reliability · 2015
Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
被引 303Robert Darveaux · Journal of Electronic Packaging · 2002
In Situ Diagnostics and Prognostics of Wire Bonding Faults in IGBT Modules for Electric Vehicle Drives
被引 329Bing Ji, Volker Pickert, Wenping Cao · IEEE Transactions on Power Electronics · 2013
此处列出前 3 条
引用本文 32
Study of the effect of crystal orientation on the mechanical response and fatigue life of solder joints under thermal cycling by crystal plasticity
被引 15Mingwei Xie, Gang Chen, Xiaoxia Yuan · Journal of Materials Research and Technology · 2023
Failure Mechanism Investigations of Bond Wires Lifting-Off and Die-Attach Solder Aging Considering the Thermal Coupling Effects
被引 12Xinglai Ge, Ken Chen, Huimin Wang · IEEE Transactions on Power Electronics · 2024
Failure analysis and simulation of IGBT under active and passive thermal cycling
被引 10Jing Tao Han, Xin Li, Tong An · Microelectronics Reliability · 2025
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