研究论文

Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures

Wangyun Li, Chuantong Chen, Minoru Ueshima, Takaya Kobatake, Katsuaki Suganuma

The University of Osaka　Daicel (Japan)

来源Microelectronics Reliability

年份2023

DOI10.1016/j.microrel.2023.115105

原文https://doi.org/10.1016/j.microrel.2023.115105

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学术脉络

学科主题

工程

Electronic Packaging and Soldering Technologies

3D IC and TSV technologies · Advanced Welding Techniques Analysis

参考文献 11

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Riko I Made, Chee Lip Gan, Liling Yan · Acta Materialia · 2011

被引 32

Grain boundary self-diffusion in Cu polycrystals of different purity

T. Surholt, Chr. Herzig · Acta Materialia · 1997

被引 245

Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages

Ming Li, K.Y. Lee, D. Olsen · IEEE Transactions on Electronics Packaging Manufacturing · 2002

被引 85

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施引文献 11

Low-temperature copper sinter-joining technology for power electronics packaging: A review

Yujian Wang, Dou Xu, Haidong Yan · Journal of Materials Processing Technology · 2024

被引 72

Atomic insight in fusion mechanism of heterogeneous and homogeneous sintering: Cu and Ag nanoparticles

Jiaxin Liu, Weishan Lv, Cai Chen · Results in Physics · 2024

被引 22

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Zhe Cui, Qiang Jia, Yishu Wang · Journal of Materials Science Materials in Electronics · 2024

被引 15

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