研究论文

Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

Xiaomin Li, Ping Wu

Tianjin University

来源Microelectronics Reliability

年份2024

DOI10.1016/j.microrel.2024.115359

原文https://doi.org/10.1016/j.microrel.2024.115359

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逐年被引趋势

320

325

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被引次数 · OpenAlex

0.87

领域内被引倍数
同类平均 = 1

前 28%

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学术脉络

学科主题

工程

Electronic Packaging and Soldering Technologies

3D IC and TSV technologies · Adhesion, Friction, and Surface Interactions

参考文献 30

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

S. M. Strickland, J. D. Hester, A. K. Gowan · NASA STI Repository (National Aeronautics and Space Administration) · 2011

被引 10

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

Reza Ghaffarian · NASA Technical Reports Server (NASA) · 2013

被引 2

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Ying Ding, Ruyu Tian, Xiu‐Li Wang · Microelectronics Reliability · 2015

被引 35

此处列出前 3 条

引用本文 5

Vapour phase reflow soldering with vertical assembly stacking to improve productivity

Gergő Havellant, Balázs Illés, Patrik Kovács · Results in Engineering · 2025

被引 5

Stress-driven reliability-by-design for heterogeneous integration: from packaging architectures to intelligent management

Xinyi Jing, Weitong Sun, Yew Hoong Wong · Chip · 2026