研究论文
500 μm heavy micro-alloyed Cu wire for IGBT application: The study on microstructure characteristics, electrical fatigue fracture mechanism and bonding reliability
Bo-Ding Wu, Fei-Yi Hung, Kang-Pei Chan
National Cheng Kung University
来源Microelectronics Reliability
年份2024
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工程Silicon Carbide Semiconductor Technologies
Aluminum Alloys Composites Properties · Electronic Packaging and Soldering Technologies
参考文献 22
Copper Wire Bonding Concerns and Best Practices
被引 86Preeti Chauhan, Z.W. Zhong, Michael Pecht · Journal of Electronic Materials · 2013
Latent catalyst effects in halogen‐free epoxy molding compounds for semiconductor encapsulation
被引 26Je Hong Ryu, Ki Seop Choi, Whan Gun Kim · Journal of Applied Polymer Science · 2005
Comparison of the Oxidation Rates of Some New Copper Alloys
被引 27Linus U. J. T. Ogbuji, Donald L. Humphrey · Oxidation of Metals · 2003
此处列出前 3 条
引用本文 5
Advances in copper wire bonding technology: Material optimization, interfacial strength bonding interface reliability, and corrosion resistance
被引 5Jun Cao, Weilong Liu, Jun Wei · Journal of Alloys and Compounds · 2025
Resonant fatigue test performance of battery pack connections using wire bonding
被引 4Xing Wei, Junko Takahashi, Kohei Tatsumi · Microelectronics Reliability · 2025
A Multi-mode aging decoupling monitoring method for IGBT modules based on TSEPs separation strategy
被引 2Mingxing Du, Songwei Guo, Jinliang Yin · Microelectronics Reliability · 2025
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