研究论文
A comparative study between the improved unified creep-plasticity model and Anand model: Experimental investigations at the material-scale and packaging structure-scale
Fan Yang, Yuexing Wang, Linwei Cao, Xiangyu Sun, Yao Yao
Xi'an University of Architecture and Technology China Academy of Engineering Physics
来源Microelectronics Reliability
年份2025
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逐年被引趋势
530
526
关键指标
5
被引次数 · OpenAlex
1.43
领域内被引倍数
同类平均 = 1
同类平均 = 1
前 19%
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同领域 · 同年份 · 同类型
同领域 · 同年份 · 同类型
25
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学术脉络
学科主题
工程Electronic Packaging and Soldering Technologies
Metal Forming Simulation Techniques · Numerical methods in engineering
参考文献 25
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder
被引 14Yao Yao, Semyon Vaynman, L. M. Keer · Journal of Electronic Materials · 2007
A continuum damage mechanics-based unified creep and plasticity model for solder materials
被引 114Yao Yao, Xu He, L. M. Keer · Acta Materialia · 2014
A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity
被引 149David L. McDowell · International Journal of Plasticity · 1992
此处列出前 3 条
引用本文 5
In-situ measurement and crystal plasticity analysis of internal stresses in advanced packaging under thermal cycling
被引 0Yihang Liang, Bofeng Li, Linwei Cao · Microelectronics Reliability · 2026
Bayesian optimization of CSP solder joint geometry using an LSTM-generated surrogate model
被引 0Shuai Shi, Shuai Zhang, Miao Zhu · Microelectronics Journal · 2026
Effect of PCB Moisture Absorption on Damage Evolution in BGA Solder Joints
被引 0Saeed Akbari, Dag Andersson · 2026
按被引量排序，此处列出前 3 条