研究论文

Analysis and optimization of Cu/SiO2 hybrid bonding interfacial reliability based on FEA and GABP-NSGA Ⅱ algorithm

Li Zhao, Wenchao Tian, Shaoli Huang, Zhiqiang Chen, Yongkun Wang

Xidian University

来源Materials Science in Semiconductor Processing

年份2025

DOI10.1016/j.mssp.2025.109782

原文https://doi.org/10.1016/j.mssp.2025.109782

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Electronic Packaging and Soldering Technologies

3D IC and TSV technologies · Manufacturing Process and Optimization

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Room-Temperature Charge Stability Modulated by Quantum Effects in a Nanoscale Silicon Island

S. J. Shin, J. J. Lee, H. J. Kang · Nano Letters · 2011

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