研究论文
Mechanical properties and microstructure of large-area diamond/silicon bonds formed by pressure-assisted silver sintering for thermal management
Kechen Zhao, Jiwen Zhao, Xiaoyun Wei, Xu Zhang, Chaojun Deng, Yong Yang, Wenxin Cao, Jiecai Han 等 10 位
Harbin Institute of Technology Huawei Technologies (China)
来源Materials Today Communications
年份2022
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28
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学术脉络
学科主题
材料 / 化学Diamond and Carbon-based Materials Research
Adhesion, Friction, and Surface Interactions · Advanced materials and composites
参考文献 55
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
被引 362Peng Peng, Anming Hu, A.P. Gerlich · ACS Applied Materials & Interfaces · 2015
Comparison of the interfacial thermal resistivity of silver and solder die-attach using laser flash technique
被引 5Zhiye Zhang, Jesus N. Calata, Carlos Suchicital · 2004
Methods for experimental determination of solid-solid interfacial thermal resistance with application to composite materials
被引 21Karol Pietrak, Tomasz Wiśniewski · Biuletyn Instytutu Techniki Cieplnej · 2014
此处列出前 3 条
引用本文 28
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management
被引 38Yi Zhong, Shuchao Bao, Yimin He · IEEE Electron Device Letters · 2024
Robust PI composites with high-connected AgNPs for multifunctional electromagnetic interference shielding in harsh environment
被引 15Xiaoyuan Zhang, Yuqi Yang, Gui Yang · Composites Part B Engineering · 2025
Microscopic Insights into Metallization of Diamond with Transition Metals
被引 14Saifei Fan, Kechen Zhao, Sen Zhang · Advanced Functional Materials · 2024
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