研究论文
Molecular dynamics simulation study of Zr interposer promoting Cu-Cu low-temperature hybrid bonding
Wentao Ni, Rui Li, Zhiqiang Tian, Guangchuan Zhao, Shizhao Wang, Xiao‐Yong Miao
Wuhan University Wuhan University of Technology Fudan University Shanghai Fudan Microelectronics (China)
来源Materials Today Communications
年份2024
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工程3D IC and TSV technologies
Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties
参考文献 63
Demonstration and Electrical Performance of Cu–Cu Bonding at 150 °C With Pd Passivation
被引 103Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng · IEEE Transactions on Electron Devices · 2015
Investigation of Zr and Si diffusion behaviors during reactive diffusion – a molecular dynamics study
被引 17Hui‐Lung Chen, Shin‐Pon Ju, Tsang-Yu Wu · RSC Advances · 2015
Fast Parallel Algorithms for Short-Range Molecular Dynamics
被引 45,184Steven J. Plimpton · Journal of Computational Physics · 1995
此处列出前 3 条
引用本文 9
Experimental study and molecular dynamics simulation of Ag/Ti diffusion bonding
被引 9Liuyong Wang, Hao Wang, Qin Zou · Surfaces and Interfaces · 2024
Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging
被引 7Jeehoo Na, Eun Hye Lee, Kyungho Park · Advanced Materials Technologies · 2024
A study on the mechanical properties of polycrystalline aluminum nitride based on molecular dynamics simulation
被引 5Rui Li, Chunmin Cheng, Fang Dong · Materials Today Nano · 2025
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