研究论文
Sintering mechanism between silver nanoparticles and SiC/Cu plates: A molecular dynamics simulation
Guigen Ye, Jiansheng Zhang, Peng Zhang, Meng Kang
China University of Petroleum, East China
来源Powder Technology
年份2024
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Powder Metallurgy Techniques and Materials · 3D IC and TSV technologies
参考文献 33
Molecular Dynamics Simulation of Sintering and Surface Premelting of Silver Nanoparticles
被引 69Hani Alarifi, M. Atis, C. Özdoğan · MATERIALS TRANSACTIONS · 2013
Crack propagation behaviors at Cu/SiC interface by molecular dynamics simulation
被引 77Zhenyu Yang, Yanguang Zhou, Tao Wang · Computational Materials Science · 2013
Fast Parallel Algorithms for Short-Range Molecular Dynamics
被引 44,300Steven J. Plimpton · Journal of Computational Physics · 1995
此处列出前 3 条
引用本文 22
Probing oscillatory pressure sintering mechanisms and mechanical properties of Ti6Al4V alloys via MD simulation
被引 16Pengfei Wu, Tie Wei, Wei Zhang · Powder Technology · 2025
Present status and prospects of nano-silver particles in the electronic field: a review
被引 14Jiayi Li, Shuai Zhang, Kyung‐Wook Paik · Journal of Adhesion Science and Technology · 2024
Densification mechanism and surface mechanical failure evolution of complex silver nanoparticle interconnection interface via pressure-assisted forced bonding
被引 13Weishan Lv, Zexiang Zheng, Baihan Liu · Applied Surface Science · 2024
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