研究论文
A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
Yu Zhang, Renke Kang, Shang Gao, Jinxing Huang, Xianglong Zhu
Dalian University of Technology
来源Precision Engineering
年份2021
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53
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学术脉络
学科主题
工程Advanced Surface Polishing Techniques
Advanced machining processes and optimization · Advanced Machining and Optimization Techniques
参考文献 33
Contact Mechanics
被引 7,722K. L. Johnson · Cambridge University Press eBooks · 1985
A comparison of two models to predict grinding forces from wheel surface topography
被引 90Jeffrey Badger, A.A. Torrance · International Journal of Machine Tools and Manufacture · 2000
A new surface roughness prediction model for ceramic grinding
被引 47Sanjay Agarwal, P. Venkateswara Rao · Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture · 2005
此处列出前 3 条
引用本文 53
Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing
被引 159Shang Gao, Honggang Li, Han Huang · Applied Surface Science · 2022
Three-dimensional topography modelling and grinding performance evaluating of micro-structured CVD diamond grinding wheel
被引 86Zhenfei Guo, Bing Guo, Guicheng Wu · International Journal of Mechanical Sciences · 2022
Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding
被引 60Shang Gao, Haoxiang Wang, Han Huang · International Journal of Extreme Manufacturing · 2025
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