研究论文
Molding compounds based on aminophenoxyphthalonitrile/epoxy resin for high-temperature electronic packaging applications
Jiateng Huang, Feiyu Zhu, Wei Hu, Qiunan Xie, Xiaohan Li, Xiaoma Fei, Jingcheng Liu, Xiaojie Li 等 9 位
Jiangnan University
来源Reactive and Functional Polymers
年份2024
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逐年被引趋势
1050
24
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26
关键指标
18
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2.03
领域内被引倍数
同类平均 = 1
同类平均 = 1
前 14%
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同领域 · 同年份 · 同类型
同领域 · 同年份 · 同类型
55
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学术脉络
学科主题
材料 / 化学Synthesis and properties of polymers
Epoxy Resin Curing Processes · Polymer crystallization and properties
参考文献 55
Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
被引 26Shinji Komori, Yushi Sakamoto · 2008
Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review
被引 124Yongcun Zhou, Feng Liu, Hong Wang · Polymer Composites · 2015
Phenol‐containing phthalonitrile polymers – synthesis, cure characteristics and laminate properties
被引 80Dhanya Augustine, Dona Mathew, C. P. Reghunadhan Nair · Polymer International · 2013
此处列出前 3 条
引用本文 18
Novel furfuryl-based phosphaphenanthrene containing N/P flame retardant: towards epoxy resin with excellent flame retardancy, enhanced toughness and low dielectric constant
被引 49Quanbing Shen, Beibei Yu, Dong Chen · Chemical Engineering Journal · 2025
Polymer-Based Electronic Packaging Molding Compounds, Specifically Thermal Performance Improvement: An Overview
被引 43Xiaohan Li, Jiateng Huang, Ya‐Wen Chen · ACS Applied Polymer Materials · 2024
Progress in high temperature resistant phthalonitrile resins and their composites for aerospace applications
被引 34Bing Han, Yong Li, Jing Wan · Reactive and Functional Polymers · 2025
按被引量排序，此处列出前 3 条