研究论文
A mechanics-based predictive model for scratching defects and its application for pad selection in chemical mechanical polishing
Hyeongmin Je, Dong Geun Kim, Dong Geun Kim, Seounghee Yun, Somin Shin, Haesung A. Lee, Sanha Kim, Hyunsoo Kim 等 9 位
Korea Advanced Institute of Science and Technology Samsung (South Korea) Samsung Electronics (South Korea)
来源Tribology International
年份2025
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学术脉络
学科主题
工程Advanced Surface Polishing Techniques
Advanced machining processes and optimization · Adhesion, Friction, and Surface Interactions
参考文献 54
Device performance analysis on 20nm technology thin wafers in a 3D package
被引 18Sukeshwar Kannan, Rahul Agarwal, A. Bousquet · 2015
An Asperity Microcontact Model Incorporating the Transition From Elastic Deformation to Fully Plastic Flow
被引 840Yongwu Zhao, David M. Maietta, Lebing Chang · Journal of Tribology · 1999
Measurement of real contact area and analysis of stick/slip region
被引 65Masao Eguchi, Takashi Shibamiya, Takashi Yamamoto · Tribology International · 2009
此处列出前 3 条
引用本文 10
Material removal rate model in chemical-mechanical polishing using micro-structured pads
被引 17Seounghee Yun, Hyun Jun Ryu, Sanha Kim · International Journal of Mechanical Sciences · 2025
Challenges and Innovations in Chemical Mechanical Polishing in the More-than-Moore Era
被引 9Hyeongmin Je, Sukkyung Kang, Sanha Kim · International Journal of Precision Engineering and Manufacturing-Green Technology · 2026
Machine Learning-Driven Optimization of Silicon Carbide Chemical Mechanical Polishing with Surface Roughness Constraints
被引 9Hujingyue Wang, Zhen Qin, Lihong Zhang · Langmuir · 2026
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