研究论文
Brittle-to-ductile transition depth and ductile deformation mechanisms during grinding of 4H-SiC crystals
Kechong Wang, Haobo Chen, Yu‐Fei Wu, О. В. Захаров, Yanquan Geng, Chen Li
Harbin Institute of Technology Moscow State Technological University Suzhou Research Institute
来源Tribology International
年份2025
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逐年被引趋势
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32
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9.89
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学术脉络
学科主题
工程Advanced Surface Polishing Techniques
Advanced machining processes and optimization · Advanced ceramic materials synthesis
参考文献 83
A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials
被引 224Muhammad Shoaib Arif, Zhang Xinquan, Mustafizur Rahman · International Journal of Machine Tools and Manufacture · 2012
Fixed abrasive grinding of CVD SiC mirrors
被引 32Thomas G. Bifano, Yi Yuan, Keith Kahl · Precision Engineering · 1994
Deformation and removal characteristics in nanoscratching of 6H-SiC with Berkovich indenter
被引 62Binbin Meng, Feihu Zhang, Zhipeng Li · Materials Science in Semiconductor Processing · 2014
此处列出前 3 条
引用本文 32
A comprehensive dynamic force model involved in grinding of B <sub>4</sub> C ceramics
被引 19Zongze Wei, Chen Li, Ziyi Wang · International Journal of Extreme Manufacturing · 2026
Material removal mechanisms in hybrid fixed-loose abrasive machining of SiC
被引 14Xu Chen, Lei Guo, Jizhuang Hui · International Journal of Mechanical Sciences · 2026
Damage evolution and abrasive wear behaviors involved in ultrafast laser-assisted grinding of SiC ceramics
被引 11Yue Liu, Chen Li, Ziyi Wang · Tribology International · 2025
按被引量排序，此处列出前 3 条