研究论文
Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
Dong Hae Ho, Chenming Hu, Ling Li, Michael D. Bartlett
Virginia Tech
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参考文献 52
Stretchable active-matrix organic light-emitting diode display using printable elastic conductors
被引 1,766Tsuyoshi Sekitani, Hiroyoshi Nakajima, Hiroki Maeda · Nature Materials · 2009
An overview of through-silicon-via technology and manufacturing challenges
被引 315J. Gambino, Shawn A. Adderly, John Knickerbocker · Microelectronic Engineering · 2015
Design and Fabrication of Novel Stretchable Device Arrays on a Deformable Polymer Substrate with Embedded Liquid‐Metal Interconnections
被引 99Jangyeol Yoon, Soo Yeong Hong, Yein Lim · Advanced Materials · 2014
此处列出前 3 条
施引文献 49
Connecting the Dots: Sintering of Liquid Metal Particles for Soft and Stretchable Conductors
被引 95Simok Lee, Syed Ahmed Jaseem, Nurit Atar · Chemical Reviews · 2025
Materials design and integration strategies for soft bioelectronics in digital healthcare
被引 48Hye Jin Kim, Ja Hoon Koo, Seunghwan Lee · Nature Reviews Materials · 2025
Flexible Microinterventional Sensors for Advanced Biosignal Monitoring
被引 32Ying Liu, Peidi Fan, Yuxiang Pan · Chemical Reviews · 2025
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