Ion implantation as an ultrafast quenching technique for metastable alloy production: The Ag-Cu system
J. M. Poate, J. A. Borders, A. G. Cullis, J. K. Hirvonen
Electronics and Radar Development Establishment United States Naval Research Laboratory
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Substitutional solid solutions of Ag in Cu have been formed by ion implanting Ag at concentrations up to 16 at.%. The physical states of the implanted alloys were deduced by ion channeling and transmission electron microscopy and their stability was examined by annealing to 400 °C. The implantation results are compared with those obtained previously by conventional rapid quenching techniques.
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材料 / 化学Microstructure and mechanical properties
Copper Interconnects and Reliability · Aluminum Alloy Microstructure Properties
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