High performance top-gated multilayer WSe ₂ field effect transistors

In this paper, high performance top-gated WSe 2 field effect transistor (FET) devices are demonstrated via a two-step remote plasma assisted ALD process. High-quality, low-leakage aluminum oxide (Al 2 O 3 ) gate dielectric layers are deposited onto the WSe 2 channel using a remote plasma assisted ALD process with an ultrathin (∼1 nm) titanium buffer layer. The first few nanometers (∼2 nm) of the Al 2 O 3 dielectric film is deposited at relatively low temperature (i.e. 50 °C) and remainder of the film is deposited at 150 °C to ensure the conformal coating of Al 2 O 3 on the WSe 2 surface. Additionally, an ultra-thin titanium buffer layer is introduced at the WSe 2 channel surface prior to ALD process to mitigate oxygen plasma induced doping effects. Excellent device characteristics with current on–off ratio in excess of 10 6 and a field effect mobility as high as 70.1 cm 2 V –1 s –1 are achieved in a few-layer WSe 2 FET device with a 30 nm Al 2 O 3 top-gate dielectric. With further investigation and careful optimization, this method can play an important role for the realization of high performance top gated FETs for future optoelectronic device applications.