研究论文
Interplay between morphology and thickness of a SiN interlayer for enhanced thermal transport across the GaN/diamond interface
Nian Xiao, H. Chen, Shuang Tian, Yan Zhou, Lina Yang, Lifa Zhang, Dengke Ma
Nanjing Normal University Nanjing University of Posts and Telecommunications Beijing Institute of Technology
阅读操作
确认中在文库中上传 PDF 后可生成中文音频讲解。
摘要与影响
摘要 · 节选
暂未获取摘要。可打开原文或 PDF，后续可基于全文生成更完整的速读。
逐年被引趋势
210
226
关键指标
2
被引次数 · OpenAlex
0.42
领域内被引倍数
同类平均 = 1
同类平均 = 1
前 45%
引用位次
同领域 · 同年份 · 同类型
同领域 · 同年份 · 同类型
50
参考文献
Google Scholar 与 OpenAlex 的被引统计范围不同，数值存在差异属正常。
AI 辅助阅读
依据：文献信息
论文问答
当前基于文献信息回答
可就本文提问；依据不足时会说明。
学术脉络
学科主题
材料 / 化学Thermal properties of materials
Diamond and Carbon-based Materials Research · GaN-based semiconductor devices and materials
参考文献 50
Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics
被引 153Yoonjin Won, Jungwan Cho, Damena D. Agonafer · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015
Thermal conductance of interfaces between highly dissimilar materials
被引 575Ho-Ki Lyeo, David G. Cahill · Physical Review B · 2006
Molecular dynamics simulation of thermal boundary conductance between carbon nanotubes and SiO2
被引 288Zhun‐Yong Ong, Eric Pop · Physical Review B · 2010
此处列出前 3 条
引用本文 2
Surface amorphization enables phonon mode activation and enhanced thermal transport at 2D/3D van der Waals heterostructures
被引 0Abid Ullah, Yucheng Xiong, Qamar Wali · International Journal of Heat and Mass Transfer · 2026
Phonon-mediated heat transfer across quantum dot-solvent interfaces: From ligand collapse to solvent infiltration
被引 0Yinong Liu, Shouhang Li, Wee‐Liat Ong · International Journal of Heat and Mass Transfer · 2026
按被引量排序，此处列出前 3 条