Interface Covalent Fluorination Targeting Superior All-Solid-State Insulation
Haoou Ruan, Wei-hao Wang, Takahiro Umemoto, Akiko Kumada, Masahiro Sato
The University of Tokyo
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All-solid-state insulation systems are increasingly sought after in power equipment due to their superior reliability and safety. However, interfacial discrepancies in laminated composites remain a significant challenge. This study introduces a covalent fluorination strategy to enhance the interfacial performance of epoxy-impregnated aramid paper laminates. By combining non-thermal plasma activation and fluorosilane grafting, interfacial modifications with varying fluorinated chain lengths were achieved. Surface characterization confirmed the successful grafting of fluorine-containing moieties. Dielectric testing showed a 30 % reduction in dielectric loss, while mechanical analysis revealed a 55 % improvement in tensile strength for short-chain fluorinated samples. Excessively long chains, however, weakened interfacial cohesion and reduced Young's modulus. Electrical breakdown strength increased by 38 %, and field-induced conductivity decreased by 80 %, highlighting fluorine's role in suppressing discharge and limiting charge transport. These results demonstrate that covalent fluorination effectively mitigates dielectric and mechanical deficiencies, offering a promising approach for designing high-performance all-solid-state insulation systems.
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