研究论文
Passi4: The next Technology for Passive Integration on Silicon
A. den Dekker, A. van Geelen, P. P. van der Wel, R. Koster, Elise C. Rodenburg
来源2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
年份2007
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摘要与影响
摘要 · 完整
A new technology for passive integration on silicon is presented. Accurate low density capacitors, high density capacitors, coils, resistors and trough wafer interconnect enable the realization of a highly miniaturized front-end module (FEM) for GSM without SMD's. Partitioning of passives is optimized to achieve minimum size (6times6times1 mm3) and low cost at acceptable performance.
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学术脉络
学科主题
工程Radio Frequency Integrated Circuit Design
Microwave Engineering and Waveguides · 3D IC and TSV technologies
参考文献 4
RF Characterisation and Process Control for Passive Integration Components
被引 3Paul J. van der Wel, Johan F. Dijkhuis, Christophe Chanlo · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2007
High-Q integrated RF passives and RF-MEMS on silicon
被引 21Joost T.M. van Beek, M. H. W. M. van Delden, A. van Dijken · MRS Proceedings · 2003
Miniaturized Quad-Band Front-End Module for GSM using Si BiCMOS and passive integration technologies
被引 8A.J.M. de Graauw, A. van Bezooijen, Christophe Chanlo · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 2006
此处列出前 3 条
引用本文 9
Trend from ICs to 3D ICs to 3D systems
被引 60Rao Tummala, Venky Sundaram, Ritwik Chatterjee · IEEE Custom Integrated Circuits Conference (CICC) · 2009
Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer
被引 18Changming Song, Qian Wang, Kai Zheng · International Conference on Electronic Packaging Technology (ICEPT) · 2022
3D chip stack with integrated decoupling capacitors
被引 14Bing Dang, S. L. Wright, Paul S. Andry · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2009
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