研究论文
Thermal solution for Co-Packaged Optics (CPO) modules
Keiji Matsumoto, Mukta Farooq, John Knickerbocker
IBM Research - Tokyo
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摘要与影响
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In Co-Packaged Optics (CPO) where optical devices and ICs are attached to a common base substrate, there are requirements to keep the temperature of high-heat-dissipating ICs as low as possible and also to keep the temperature of optical devices constant. We propose two solutions to meet these two requirements and show the effect of two solutions by simulation.
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学术脉络
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工程Semiconductor Lasers and Optical Devices
Photonic and Optical Devices
参考文献 4
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被引 18Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022
Advanced Packaging Technologies for Copackaged Optics
被引 23Mei-Ju Lu, Sin-Yuan Mu, Chia-Sheng Cheng · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022
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被引 5Yasha Yi, Bowen Yu · IEEE Journal of Selected Topics in Quantum Electronics · 2025
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被引 0David Coenen, Herman Oprins, Yoojin Ban · IEEE Transactions on Components Packaging and Manufacturing Technology · 2026
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