A novel ultra-thin 90° bent vapor chamber for heat dissipation in multi-heat source electronic devices

With the high development of miniaturization, lightweight, and integration of the miniature electronic manufacturing industry, the traditional heat dissipation methods have been difficult to satisfy the high-power density heat dissipation challenges of multi-heat source electronic devices in a narrow space. At the same time, the amount of power chips on the PCB in electronic devices has increased dramatically, and the phenomenon that the heated and condensation parts are not in the same plane is becoming more and more general. The phase change heat transfer heat sink, which uses the latent heat of liquid medium to transfer heat through phase change, is the most efficient heat transfer device to solve the high heat flux heat dissipation problem. Herein, based on the phase change heat transfer heat sink, an ultra-thin 90° bent vapor chamber (UTBVC) that achieves up to 50 W of heat dissipation from multiple heat sources and has not yet reached the critical power of the heat sink is proposed. Furthermore, the study delves into how the heat transfer capability of UTVCs changes depending on their filling ratios and examines how their thermal resistance is affected by bending. In this work, the UTBVC is shown to have an excellent heat transfer performance, which reduced the heat source temperature by 23.44°C at 50 W with a maximum temperature difference of less than 1°C at the evaporation surface. In this study, a novel and feasible solution to heat dissipation in a narrow space with multiple heat sources is provided by the UTBVC, and a brave design for the bent vapor chambers in different planes is also offered.