Design of a wideband Package for MMIC Applications Based on High Temperature Co-fired Ceramic

With the rapid advancement of 5G communications, artificial intelligence, and high-performance computing technologies, modern integrated circuits face escalating demands for signal processing frequencies and transmission rates. The High-Temperature Co-Fired Ceramic (HTCC)-based Ceramic Quad Flat No-Lead (CQFN) packaging demonstrates significant application value in microwave/millimeter-wave integrated circuit packaging, owing to its superior electrical performance and structural advantages.This study presents the design and implementation of an innovative HTCC-based CQFN package structure. Significant improvements in the package's impedance matching characteristics and high-frequency signal transmission performance were achieved through systematic optimization of the topological structure in the internal transmission lines and grounding configuration. Experimental characterization reveals exceptional transmission properties across DC-50 GHz, with insertion loss below 1.24 dB and return loss better than-11.53 dB. Considering the influence of machining error and welding, the measured data of vector network analyzer are in good agreement with the simulation results which verifies the effectiveness of the design method. This packaging scheme provides an interconnection solution with high transmission efficiency and excellent environmental adaptability for millimeter wave monolithic microwave integrated circuit (MMIC), which is of great engineering significance for promoting the integration of high frequency electronic systems.