Integrating world-class radiance RTP technology onto a low cost of ownership production-worthy platform
R. Boas, N. Tam, Wen Chang, T. Leong, T. Green
Applied Materials (United States)
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The Radiance Vantage 300 product offers the production-proven performance of the Radiance 300 mm RTP chamber at a reduced cost of ownership. Tool architecture was developed with the goals of system simplification, shipment improvement, and startup time reduction. These goals were accomplished through designs that preserve the final test tool configuration and a new pre-facilitization concept that allows fab preparation to be completed in parallel with tool manufacture. Reduced system footprint combined with high throughput results in effective fab utilization. Ambient control comparable to that of a cluster tool has been verified through oxygen-sensitive process results. Marathon results for cobalt silicide formation, spike anneal, and emissivity independence are presented and demonstrate the readiness of the newest Applied Materials RTP platform for semiconductor production environments.
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工程Semiconductor materials and devices
Advanced Materials and Semiconductor Technologies · Advancements in Photolithography Techniques
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